Titanium Tungsten Alloy Sputtering Target (Ti-W)
Formulated with precise Ti/W ratios (e.g. 10/90 wt%) and ultra-low alkali metal impurities. Essential for diffusion barriers in semiconductor microelectronics and solar cell manufacturing.
Sputtering Target
High-Purity Sputtering Targets & Cathodes Manufacturer
Almerca Titanium Industry Co., Ltd. is a premier global manufacturer and direct factory supplier of high-purity planar, rotary, and custom alloy sputtering targets. Engineered for Magnetron Sputtering and Physical Vapor Deposition (PVD) processes, our targets deliver exceptional film uniformity, high thermal conductivity, low gas content, and ultra-high density (>99.5%). Serving semiconductor, architectural glass coating, optical displays, solar energy, and decorative hard coatings worldwide.
High Purity Titanium Sputtering Target (3N5 / 4N5 / 5N)
Purified up to 99.999% purity with uniform fine-grained microstructures (<50 μm). Engineered for semiconductor interconnects, optical coatings, and flat panel display PVD lines.
Tubular Targets & Arc Cathodes
Available in pure Titanium, Copper, Chromium, Zirconium, Tantalum, and customized metal alloys. Engineered for cathodic arc deposition and heavy-duty industrial hard coatings.
Rotary / Rotatable Sputtering Targets
Molybdenum, Tungsten, Tantalum, and Titanium rotatable targets up to 4000mm length. Maximizes material utilization up to 80% with minimal nodule formation for large glass coaters.
Planar Sputtering Targets (Mo, Cr, Ti, Ti-Al)
High purity 99.99% rectangular and circular planar targets. Custom bonded to copper backing plates (Cu-backing plate) with metallic indium or elastomeric bonding techniques.
ASTM B265 Grade 2 Titanium Targets
Standard ASTM B265 Gr2 disc and plate targets with bolt-down or threaded features. Cost-effective solution for wear-resistant TiN, TiCN, and decorative PVD film applications.
Engineering Excellence & Quality Assurance
At Almerca Titanium Industry Co., Ltd., we combine Vacuum Induction Melting (VIM), Vacuum Arc Remelting (VAR), Hot Isostatic Pressing (HIP), and thermomechanical processing to achieve consistent grain refinement and isotropic crystal orientation across every target batch. Every item undergoes rigorous non-destructive Ultrasonic Flaw Detection (UT) and Glow Discharge Mass Spectrometry (GDMS) elemental purity testing.
| Material Grades | Pure Ti (99.9% - 99.999%), Ti-W (10/90wt%), Ti-Al (50/50, 30/70, 40/60), Mo, Cr, Ta, Zr, Nb |
|---|---|
| Purity Levels | 3N5 (99.95%), 4N (99.99%), 4N5 (99.995%), 5N (99.999%) |
| Target Geometries | Circular Discs (Dia 1" to 24"), Rectangular Planar (L up to 3000mm), Rotary Cylindrical (L up to 4000mm) |
| Relative Density | ≥ 99.5% theoretical density (crack-free, zero pore inclusion) |
| Average Grain Size | ≤ 100 μm (Custom fine-grain structures available ≤ 30 μm) |
| Bonding Options | Indium Metal Bonding, Elastomeric Polymer Bonding, Copper/OFHC Backing Plates |
| Quality Compliance | EN 10204 3.1 Material Test Certificate (MTC), GDMS Purity Report, Ultrasonic Testing (UT) |
Request Technical Specifications & Direct Factory Quotation
Need custom target dimensions, specialized alloy compositions, or quick turnaround delivery for your coating system? Contact our technical engineering team at Almerca Titanium Industry Co., Ltd. today.
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