High-Purity Deposition Materials

High-Purity Titanium Sputtering Target & Thin-Film Materials

Engineered for semiconductor interconnects, optical coatings, architectural glass, display panels, and hard wear-resistant PVD applications. Available in 3.5N to 5N purity, custom planar, and high-yield rotary geometries.

Contact Us Request Technical Data Sheet
99.999%
Max Purity (5N GDMS Verified)
< 50 μm
Ultra-Fine Equiaxed Grain Size
> 98%
Indium Bonding Integrity (UT Tested)
High Purity Titanium Sputtering Target Precision Processing - Almerca Titanium Industry Co., Ltd.
Product Engineering Portfolio

High-Performance Titanium Sputtering Target Classifications

Almerca Titanium Industry Co., Ltd. manufactures a full spectrum of Titanium Sputtering Targets manufactured from high-purity sponge titanium via Vacuum Electron Beam Melting (EB) and Vacuum Arc Remelting (VAR), followed by precision thermo-mechanical processing (TMP) to guarantee microstructural uniformity and low gas content.

High Purity Planar Titanium Sputtering Target

High-Purity Planar Titanium Targets

Designed for standard magnetron sputtering systems. Available in circular disc and rectangular formats with custom backing plate assemblies (Copper C11000, Molybdenum, or Stainless Steel).

  • Purity Range: 3.5N (99.95%), 4N (99.99%), 4.5N (99.995%), 5N (99.999%)
  • Planar Dimensions: Circular up to Ø500mm, Rectangular up to L2000mm × W300mm
  • Density: > 99.8% Theoretical Density (Zero internal voids)
Inquire Custom Size
Rotary Cylindrical Titanium Sputtering Target

Rotary / Cylindrical Titanium Targets

Engineered for large-area inline coaters, architectural Low-E glass lines, and solar cell metallization. Provides target material utilization rates exceeding 75–80%.

  • Structure: Monolithic or Indium Bonded to Stainless/Copper Support Tube
  • Dimensions: Outer Diameter (OD) 150mm - 170mm, Length up to 3800mm
  • Advantage: Extended coating campaigns with reduced nodule growth
Inquire Rotary Specs
Titanium Alloy Sputtering Targets TiAl TiZr TiNb

Titanium Alloy Sputtering Targets

Custom titanium binary and ternary alloy targets for extreme hard coatings (TiAlN, TiSiN, TiCrN) and functional optical dielectric layers.

  • Alloy Formulations: Ti-Al (50/50, 33/67 at%), Ti-Zr, Ti-Nb, Ti-Ni, Ti-Cr, Ti-Si
  • Manufacturing: Hot Isostatic Pressing (HIP) or Vacuum Melting
  • Applications: Cutting tools, decorative PVD, semiconductor diffusion barriers
Inquire Alloy Formulations

Standard Specification Matrix: Titanium Sputtering Target

Purity Grade Ti Content (%) Impurity Limits (ppm max) Typical Applications Available Forms
3.5N (Industrial) 99.95% Fe < 150, O < 300, N < 50, C < 50, H < 20 Decorative PVD coatings, watch cases, door hardware, automotive trim Planar Discs, Plates, Tiles
4N (Optical/Display) 99.99% Fe < 30, O < 150, N < 20, C < 20, H < 10 TFT-LCD display electrodes, optical anti-reflective coatings, Low-E glass Planar Rectangular, Rotary Tubes
4.5N (Advanced Optics) 99.995% Fe < 10, O < 100, N < 10, C < 10, H < 5 Touch panel sensors, thin-film solar cell back-contact metallization Planar, Rotary Monolithic
5N (Semiconductor) 99.999% Fe < 1, Ni < 1, Cr < 1, Cu < 1, Na < 0.5, K < 0.5 VLSI interconnects, barrier layers (Ti/TiN), EUV mask blanks, microelectronics High-Precision Custom Planar
Engineering Insights & Information Gain

How Microstructure & Bonding Integrity Determine Deposition Quality

1. Grain Size Refinement & Texture Control (0002 Crystallographic Orientation)

In physical vapor deposition (PVD), the sputtering rate of titanium atoms is strongly directional. A coarse-grained titanium target with random crystallographic orientations causes uneven erosion tracks, local micro-arcs, particle flaking, and severe thin-film thickness variations across the wafer or glass substrate.

At Almerca Titanium Industry Co., Ltd., we utilize multi-axis forge rolling combined with strictly controlled recrystallization annealing. This proprietary thermo-mechanical treatment controls the average titanium grain size to under 50 micrometers (<50 μm) with an equiaxed grain distribution. Furthermore, we optimize the crystallographic texture toward preferred (0002) hexagonal close-packed (HCP) orientations, boosting sputtering efficiency by up to 18% while suppressing target arcing.

Titanium Microstructure Thermo-Mechanical Processing Facilities
Technical Deep-Dive: Preventing Target Debonding Under High DC Power Densities
Modern DC magnetron sputtering systems operate at power densities exceeding 15 to 25 W/cm². Without efficient heat removal through the backing plate, localized thermal expansion stresses can lead to target warping, solder melt-out, or violent debonding. Almerca Titanium guarantees thermal reliability by employing high-purity Indium (In) metallic solder bonding under vacuum degassing conditions. Every target undergoes 100% Ultrasonic Flaw Detection (UT) after bonding to verify a bonding area ratio exceeding 98%, eliminating thermal dead zones.
Market Forward Outlook

Future Procurement Trends & Technology Roadmap for Titanium Targets

Transition to Ultra-Long Rotary Targets in Architectural Glass

Global glass coaters are rapidly replacing traditional planar targets with continuous rotary titanium targets up to 3.8 meters in length. The shift is driven by the demand for double and triple-silver Low-E energy-efficient coatings, where rotary targets dramatically reduce system downtime, improve coating uniformity, and lower total cost of ownership (TCO).

Ultra-High Purity (5N5) Demand in Sub-3nm Semiconductor Nodes

As chipmakers advance toward 2nm and 1.4nm semiconductor fabrication, trace alkali metallic contaminants (Na, K, Li > 0.1 ppm) and heavy metals (U, Th > 1 ppb) in titanium barrier films become fatal to device yield. Sourcing 5N to 5N5 grade titanium targets evaluated via Glow Discharge Mass Spectrometry (GDMS) is becoming a strict procurement baseline.

Perovskite-Silicon Tandem Photovoltaic Metallization

Next-generation solar module manufacturing relies heavily on titanium sputtering targets to deposit ultrathin transparent conductive oxide (TCO) buffer layers and corrosion-resistant back contacts. Demand for customized Ti-Al alloy targets and high-density pure Ti targets in the solar sector is projected to grow at a CAGR of 16.4% through 2030.

Why Global B2B Buyers Trust Us

Almerca Titanium Manufacturing Capabilities & Quality Assurance

Vertically Integrated Production: Smelting to Precision Machining

Almerca Titanium Industry Co., Ltd. operates 3 modern manufacturing bases spanning over 60,000 m² in Shaanxi Province, China — the hub of global titanium material science. Our integrated facility houses over 100 sets of advanced processing equipment, including Vacuum Electron Beam Smelting furnaces, 10,000-ton hydraulic forging presses, high-precision CNC vertical lathes, and Class 10,000 cleanroom bonding stations.

14+ Years
Sputtering Target Manufacturing
300 Tons/Mo
Total Titanium Processing Output
ISO 9001 & AS9100D
Certified Quality Management
50+ Countries
Global B2B Supply Network
Almerca Titanium Industry Co., Ltd. Quality Inspection Facilities
B2B Buyer FAQ

Frequently Asked Questions on Titanium Sputtering Target Procurement

Q1: What is the impact of target purity (3.5N vs. 5N) on semiconductor PVD thin film performance?
Target purity directly governs particle density, electrical resistivity, and thin-film adhesion. 3.5N (99.95%) pure titanium targets are widely specified for decorative coatings, automotive trim, and wear-resistant tool coatings (TiN/TiCN). However, microelectronics, VLSI gate electrodes, and optical filters mandate 4.5N (99.995%) to 5N (99.999%) ultra-high purity targets. Trace gaseous elements (O, N, C, H) increase film electrical resistivity, while metallic impurities (Fe, Ni, Cr) generate pinholes and thermal lattice strain, compromising device yield.
Q2: How does grain size control affect sputtering yield and film thickness uniformity?
Q3: When should rotary (cylindrical) titanium targets be selected over planar targets?
Q4: What bonding technologies does Almerca Titanium use for copper backing plates?
Q5: What quality verification documents accompany each batch of titanium sputtering targets?
Q6: How are titanium targets packaged to prevent contamination during international transit?

Ready to Optimize Your PVD Sputtering Process?

Contact our metallurgical engineers today for custom target designs, detailed technical datasheets, GDMS purity verification, and competitive factory-direct quotes.

Contact Us Email: [email protected]